Obtained according to information MediaTek’s Dimensity 9400 chipset will be the processor with the largest die size among those produced for smartphones. It is also said that more than 30 billion transistors will be used, which is a 32% increase compared to the 22.7 billion transistors used in the Dimensity 9300.
With the increase in die size, it will provide various advantages such as more transistors, higher cache memory and larger NPU. However, this situation has only one disadvantage, which is the increase in cost. The GPU performance of the Dimensity 9400 chipset will be 20% better than the previous generation and is said to be able to surpass Snapdragon 8 Gen 4.
The die size of the Dimensity 9400 will be 150mm² and TSMC’s 3nm N3E process process will be used. It is thought that the die size may have been increased to solve the overheating problem caused by ARM Cortex-X5. Let’s also say that with the increase in die size, MediaTek may be the most expensive smartphone chipset.
