Qualcomm unveils its latest micro-powered QCC730 Wi-Fi chip and RB3 Gen 2 robotics platform for drones, cameras and other industrial devices, promising improved range and data transfer speeds while consuming less power and offering direct cloud connectivity announced.
The QCC730 dual-band micro-power Wi-Fi chip is aimed at IoT devices, with Qualcomm claiming 88% less power per data transfer compared to the previous generation. The new Wi-Fi chip also provides direct cloud connectivity and Matter integration, while also offering cloud connectivity transfer via the open source SDK and IDE as well as software stack. The chip is designed as an alternative to Bluetooth for IoT applications and can operate in hosted and unhosted modes.
The RB3 Gen 2 robot platform has in-device artificial intelligence for corporate and industrial solutions. This is a mid-range option on Qualcomm’s robotics platform that includes Qualcomm’s QCS6490 CPU (8-core, up to 2.7GHz), Adreno 643 GPU, multi-camera sensor support, and integrated Wi-Fi 6E chip. Emerges. There is also Bluetooth 5.2 and LE audio support. Development kits come with a power supply, speakers, USB cable, and a development board. Qualcomm also offers Vision Kits that include mounting brackets and Camera Serial Interface (CSI) cameras. RB3 Gen 2 is expected to be available from June.
